electroless nickel shipley
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Electroless nickel plating - Shipley Company
An electroless nickel plating composition characterized by the addition of a polymer formed from a 2-acrylamido or 2-methacrylamido alkyl sulfonic acid monomer. The polymer additive increases the rate of deposition from solution, and to a minor extent, improves the
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Replenishment of electroless nickel solutions - SHIPLEY ...
As is known in the art, electroless nickel deposition refers to the chemical deposition on a receptive surface of an adherant nickel coating in the absense of an external electric source. Such deposition is useful, for example, in the provision of corrosion resistant surfaces, for decorative purposes, and the like.
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Shipley Duraposit SMT 88 Presentation-化学镍 - 豆丁网
2010-10-7 SMT88 Electroless Nickel Dr. Martin Bayes Shipley Company USA September 2002 SMT88 Product Objectives “BlackNickel” problem improveuniformity Improveconsistency bathstability Lessvariation bathidle time Maintainsame process attributes ...
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Controlled electroless plating - Shipley Company Inc.
1991-6-24 An aqueous electroless nickel plating solution comprising a source of nickel ions, a complexing agent for said nickel ions, a reducing agent capable of reducing said nickel ions to metallic form in the presence of a catalytic surface and a pH adjustor, said nickel ions being present in a concentration ranging between about 0.001 and 0.01 moles per liter and said remaining solution components being present in solution in a concentration whereby the rate at which nickel
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Shipley BPR-100 Photoresist
2019-9-24 including electroless copper and electroless nickel PROCESS GUIDELINES Shipley BPR-100 Photoresist is most commonly processed with conventional broad band (350–400 nm) radiation, although it may be imaged with laser or i-line (365 nm) radiation. A bake after developing is required. A baseline process sequence is provided as a starting point.
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Electroless plating catalyst - Shipley Company Inc.
1990-5-31 Smoluk reports electroless copper coatings with demonstrated SE values of 80 to 116 db, and electroless nickel coatings with SE values exceeding 45 db. As discussed in the literature, both electroless copper and electroless nickel have been used in the electroless plating of plastic substrates. Both have advantages and disadvantages.
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ELECTROLESS NICKEL – DATA SHEET
2016-4-26 ELECTROLESS NICKEL – DATA SHEET March 2013 The following is a brief guide on the preferred operation of electroless nickel plating systems. For additional information, please consult the Parameters Page for the specific system in use and your Surface Technology, Inc. Technical Service Representative. EQUIPMENT
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Surface properties and solderability behaviour of nickel ...
Solderability of ‘electroless nickel’ thus depended more on surface morphology than on surface oxidation. Nevertheless, further studies of the wetting kinetics of the EN deposits revealed that among the three EN deposits EN‐HP had the oxide structure that was most difficult to penetrate and thus the slowest to ‘wet’.
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Electrochemical and electroless deposition of porous zinc ...
2014-5-10 Electroless metal depositions such as the electroless deposition of nickel , copper , silver , gold or palladium are well known processes. In these reactions (1) a reducing agent in solution can be used if a catalytic surface is provided for metal growth or (2) a less noble metal on the substrate surface can be used in galvanostatic replacement ...
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Electroless Copper Plating A Review: Part I
2018-11-19 The history of electroless plating began with the serendipi-tous discovery, by Brenner and Riddell, of electroless nickel-phosphorus, during a series of nickel electroplating experi-ments in 1946.1 Electroless copper chemistry was first re-ported in the following year by Narcus. 2 The first commercial
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Shipley Duraposit SMT 88 Presentation-化学镍 - 豆丁网
2010-10-7 SMT88 Electroless Nickel Dr. Martin Bayes Shipley Company USA September 2002 SMT88 Product Objectives “BlackNickel” problem improveuniformity Improveconsistency bathstability Lessvariation bathidle time Maintainsame process attributes ...
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6.0 OPERATION
2019-4-19 5~-480A Nickel Controller 4.0 ACCESSORIES 4.1 5E-484 SAMPLE COOLING/DEGASSING ASSEMBLY (75016) The SE-484 is designed specifically for use with Shipley's DURAPOSIT® and NIPOSIT® electroless nickel plating solutions. It is comprised of two subas-semblies, the Sample Cooling Coil and the Sample Pump/ Degassing Column Assembly.
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Passivation and pitting of electroless nickel surface ...
1983-10-1 Acknowledgments The authors wish to thank Shipley Chemicals Ltd. for the supply of the electroless nickel coatings and R. Carey for work with the scanning electron microscope. References 1 G. G. Gawrilov, Chemical (Electroless) Nickel Plating, Portcullis, Redhill, Surrey, 1979. 155 2 S. A. K. Hsieh and M. F. Chung, Prod. Finish.
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ELECTROLESS NICKEL – DATA SHEET
2016-4-26 ELECTROLESS NICKEL – DATA SHEET March 2013 The following is a brief guide on the preferred operation of electroless nickel plating systems. For additional information, please consult the Parameters Page for the specific system in use and your Surface Technology, Inc. Technical Service Representative. EQUIPMENT
Read More
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Ti.n-Palladi.um Catalysts for Electroless Plating
electroless nickel solutions, consist of nickel salts, chelators, ammonia or caustic, and sodium hypophosphite, together with various addition agents and stabilisers. ... Shipley first discovered that a large excess of the stannous chloride reducing agent had the unexpected property of
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ELECTROLESS NICKEL '95 November 6-8, 1995
2008-2-15 Electroless Nickel Equipment: An Overview 5-1 William D. Fields, Palm International, Inc. How to Optimize Your Electroless Nickel Bath to Achieve the Best Quality and Performance 6-1 Brad Durkin, MacDermid, Inc. Electroless Nickel Post Treatments 7-1
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Fei氏方波对Ni-P合金镀层组成及其非晶化程度的调控作用
[11] GULLA M,SHIPLEY C R,MACKAY H A.Electroless nickel plating:US4152164[P].1979-05-01. [12] RABIZADEH T,ALLAHKARAM S R,ZAREBIDAKI A.An investigation on effects of heat treatment on corrosion properties of Ni-P electroless nano-coatings[J
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Factors influencing the formation of “black pad” in ...
2002-9-1 Nickel–gold planar surface coatings have been increasingly specified over the last ten years as the circuit board solderable finish of choice. Although offering a number of significant advantages over both conventional Hot Air Solder Levelled (HASL) finishes and alternative planar finishes, nickel–gold can, under certain conditions, be associated with a premature brittle interfacial solder ...
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Journal of The Electrochemical Society C631-C636 C631
2012-8-1 col is a surfactant, and nickel sulfate improves the catalytic effect of the deposit. Deionized water was used, and the pH was adjusted using NaOH or H2SO4. Epoxy boards ~6cm2 area! were used as the substrates for the electroless copper plating. The epoxy boards were activated accord-ing to the Shipley process, which is commercially available from
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Surface properties and solderability behaviour of nickel ...
2001-4-5 Surface properties and solderability behaviour of nickel–phosphorus and nickel–boron deposited by electroless plating
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Experimental Details
2014-5-20 Shipley Europe Ltd.. The phosphorus content within electroless nickel deposits was determined as follows. A sample of electroless nickel foil was prepared by passivating the steel substrate in chromic acid (1100 g dm'3). After through rinsing to
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Ti.n-Palladi.um Catalysts for Electroless Plating
electroless nickel solutions, consist of nickel salts, chelators, ammonia or caustic, and sodium hypophosphite, together with various addition agents and stabilisers. ... Shipley first discovered that a large excess of the stannous chloride reducing agent had the unexpected property of
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Electroless Nickel Purification / Recycle
Electroless Nickel Purification / Recycle ... Sort of think that it was Shipley. For the company you are after, They may have shared a booth at Sur-Fin. I would check with AESF's show director and their technology person. James Watts - Navarre, Florida. 1998. There are a few companies that sell this process. Look for advertising on this subject.
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ELECTROLESS NICKEL '95 November 6-8, 1995
2008-2-15 Electroless Nickel Equipment: An Overview 5-1 William D. Fields, Palm International, Inc. How to Optimize Your Electroless Nickel Bath to Achieve the Best Quality and Performance 6-1 Brad Durkin, MacDermid, Inc. Electroless Nickel Post Treatments 7-1
Read More
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500 hour salt spray resistance with electroless nickel plating
500 hour salt spray resistance with electroless nickel plating 1999. I am trying to get information on a 500 hour electroless nickel coating on aluminum. It needs to pass a 500 hour salt spray test. We our now using an old Shipley process from DuPont, Duroplate 84, with an enhancer. This gives us a 100 hours.
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Application of Electroless Nickel−Boron Films for High ...
2019-5-24 Electroless Ni exhibits excellent plasma etch resistance and has been successfully employed as a hard etch mask in the fabrication of microelectronic and microelectromechanical components and templates for contact printing and biomedical applications. The use of a catalytic agent to initiate electroless deposition is known to directly affect the microstructure and properties of the deposited ...
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Fei氏方波对Ni-P合金镀层组成及其非晶化程度的调控作用
[11] GULLA M,SHIPLEY C R,MACKAY H A.Electroless nickel plating:US4152164[P].1979-05-01. [12] RABIZADEH T,ALLAHKARAM S R,ZAREBIDAKI A.An investigation on effects of heat treatment on corrosion properties of Ni-P electroless nano-coatings[J
Read More
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Factors influencing the formation of “black pad” in ...
2002-9-1 Nickel–gold planar surface coatings have been increasingly specified over the last ten years as the circuit board solderable finish of choice. Although offering a number of significant advantages over both conventional Hot Air Solder Levelled (HASL) finishes and alternative planar finishes, nickel–gold can, under certain conditions, be associated with a premature brittle interfacial solder ...
Read More
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Kinetics of intermetallic compound growth between nickel ...
The growth kinetics, crystal structure, and morphology of the intermetallic compounds formed between nickel, electroless Ni-P and electroless Ni-B coatings with tin at 453 to 493 K for times up to 506 h have been determined by microscopical and X-ray diffraction techniques. The compound Ni3Sn4 was formed. All kinetics followed as parabolic law with activation energies of 128.0, 130.4, and 122 ...
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Journal of The Electrochemical Society C631-C636 C631
2012-8-1 col is a surfactant, and nickel sulfate improves the catalytic effect of the deposit. Deionized water was used, and the pH was adjusted using NaOH or H2SO4. Epoxy boards ~6cm2 area! were used as the substrates for the electroless copper plating. The epoxy boards were activated accord-ing to the Shipley process, which is commercially available from
Read More